Electronics Forum | Sun Apr 11 13:48:33 EDT 2021 | ngumado28898
Hi guys, I'm a newbie for SMT field. Currently, I'm facing a problem that there were many defects such as tombstone, missing, skewed, billboarding that happened with 1 type component (Resistor 0201) with a specific supplier X (we have many supplier b
Electronics Forum | Wed Apr 07 03:44:40 EDT 2010 | jackevest
The missing rate spec. of normal machine is under 0.3%, for our experience 0.1% is normal for average, if you can maintain the machine well, like the nozzle cleaning, feeder maitain...you can keep the 0.05%.
Electronics Forum | Thu Nov 18 12:00:00 EST 2004 | Shean Dalton
Have you considered mounting this component after the assembly has been washed. Then, mounting the component and cleaning its solder joints individually. Alternatively, have you considered using alternative cleaning solutions to a saponifier (and a
Electronics Forum | Mon May 13 10:16:53 EDT 2002 | pjc
After bar-coding or manual data entry the data is in the Mydata database. The data is not stored in the feeder but in the database. The database links the component data to a serialized feeder and to a PCB s/n or production batch code. The machine so
Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef
Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an
Electronics Forum | Tue Aug 31 14:36:41 EDT 1999 | JohnW
| I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under diff
Electronics Forum | Wed Sep 01 05:44:18 EDT 1999 | Wolfgang Busko
| | I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under di
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Mon Nov 26 20:11:41 EST 2007 | shy
Yes, i'm agree with you davef but i'm not put the chipbonders onto pads. i'm put the chipbonders at the beneath component (center between both component terminals) which the idea is to hold the component during wave soldering which might cause the co
Electronics Forum | Tue Nov 27 07:51:21 EST 2007 | shy
is there any gap between the pad and terminal if we place the glue? Btw, my practice to print solder pate then punch glue then PNP component and finally reflow. Also we find drop/missing chip after wave eventhough we glue the component.
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