Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Electronics Forum | Thu Jan 19 16:38:39 EST 2012 | dyoungquist
We are not using SN100C in our reflow process but I know the type of flux made a big difference with our SAC305 solder. We started out using no-clean flux in our SAC305 paste and were having some issues. We then switched over to a water soluble flu
Electronics Forum | Tue Sep 26 14:06:33 EDT 2006 | patrickbruneel
Jun 26, 2006 (See Comments Below) Editorial Managing the Naughty Child Mike Martel, Editor, Circuitnet I've been listening to voices on both sides of the RoHS issue and the more I hear, the more foreboding the tone becomes. Despite what some wr
Electronics Forum | Mon Oct 21 03:52:38 EDT 2002 | Ben
I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, there are around 2-3 voids in every balls. It is around 10% of volume ratio. I would like to ask if anyone know there is any standard of acceptable maxim
Electronics Forum | Mon Oct 21 09:09:54 EDT 2002 | Ben
thanks for ur help. i would also like to know the classes is for showing different level of requirement, or for different vertical location of void in joint. coz I heard from my workmate that the range from 9% to 36% is for void at different vertical
Electronics Forum | Tue Nov 10 07:37:32 EST 2009 | scottp
I'm curious why your customer is concerned with BGA voiding. Normal process voids, even well in excess of IPC "limits", don't effect reliability so why monkey with the process to get rid of a non-issue?
Electronics Forum | Fri Nov 13 01:45:35 EST 2009 | hallwayit
Could you clear how much void content do you client required? Normally, 5% void content is permited in clients.
Electronics Forum | Tue Nov 10 12:23:38 EST 2009 | CL
Good Morning, I agree. This has been a problem job for us. They are looking for anything that could be implicated. Right now, they are focusing on the profile. My question pertains to the frequency of micro voiding on BGA devices. I have seen some
Electronics Forum | Mon Nov 16 10:50:50 EST 2009 | ppcbs
I agree customer is being overly stringent, and that their is a possibility that BGA's have voids prior to installation. If you determine that the BGA's do not have voids prior to installation I suggest you slow down your ramp speed to allow the flu
Electronics Forum | Mon Nov 16 03:31:22 EST 2009 | cunningham
I suggest you X-Ray the devices before you place them on the board we have just foun a large amount of voids on the BGA before its even placed
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