Electronics Forum | Fri May 13 14:08:39 EDT 2011 | eezday
This appears to be black-pad and is often the result of using specs that call for gold plating that is too thick. The black pad is corrosion that is created between the gold and electroless nickel during the gold plating process. This is counter in
Electronics Forum | Thu Feb 19 11:47:06 EST 2015 | dad23honu
I had someone in another forum tell me that my assembly would fail if I had a few solder joints over the 1000ppm RoHS threshold, with all other solder joints within spec. So, I followed up with this illustration. Please let me know what you think.
Electronics Forum | Wed Mar 03 17:09:55 EST 1999 | Tom Reilly
We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 1394
Electronics Forum | Mon Mar 01 22:24:53 EST 1999 | Dave F
| It seems to be that we have to much NaCl left on our assambled PCB's. | The flux we use is from cobar. They say it can not be from the flux... So what can be the reason, what kind of problem may occer when there is to much NaCl. | George: When so
Electronics Forum | Sat Jan 09 12:31:42 EST 1999 | Steve Joy
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Tue May 19 05:42:36 EDT 1998 | Earl Moon
| Earl, | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post it to
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Wed Feb 16 05:09:30 EST 2000 | Dean
You might try a no HASL spec on your fids...but shelf life may hamper copper quality. Not a pleasant situation...opertors tend to polish the fids with erasers to compensate but this leads to eraser "bits" in your equipment and your solder! Maby op
Electronics Forum | Thu Nov 16 14:22:48 EST 2000 | Kris
Howdy Y'all, I have seen a problem lately with getting the 0402 parts out of the tape and onto a PCB. We are using Universal HSPs with 8 X 2mm feeders in good condition. The components are manufactured by Rohm. The tape and components appear to b
Electronics Forum | Tue Nov 07 09:21:27 EST 2000 | jackofalltrades
We see this type of problem with a couple of our boards. It has proven to be a problem with the board. During manufacture at the board house the thru holes for the connectors are plated a little too heavy causing a smaller hole. If you haven't alread
