Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.
unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-
Electronics Forum | Fri Oct 08 17:03:03 EDT 1999 | Dave F
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Thu Oct 05 12:50:48 EDT 2017 | davef
Why not toss a handful of the component that you're concerned about into your cleaner, clean them according to your board spec and the evaluate what happened?
Electronics Forum | Thu Sep 17 12:00:19 EDT 1998 | Mike C
| | I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas? | Wayne: More of the same as Chry and Justin. | KEY ISSUE | The first thing that you need to know is: What does your cus
Electronics Forum | Thu Jun 06 02:52:42 EDT 2002 | ianchan
Hi mates, just my 2cents worth... some folks (like us) have product runs that have BGA using no-clean, coupled that with Class3 IPC-A-610 specs, topped with aerospace/military customer defined specs. we end up cleaning NC with a degreaser machine w
Electronics Forum | Mon Feb 02 08:23:03 EST 2004 | Mark
Just something we have done with our low volume cleaning of boards. Go buy a cheap steamer and a slow cooker. Let the boards submerge in the cooker at 160 degrees on a grate for about 30 mins than spray away. Don't forget the DI-water to put in it a
Electronics Forum | Thu Jun 26 20:54:08 EDT 2008 | davef
As pointed-out above, the downside of telling your supplier how to perform a process can create problems: * It sets the cost of the operation ... I did what you told me to do * Materials selected may be incompatible ... I did what you told me to do *
Electronics Forum | Tue Apr 13 21:33:48 EDT 2004 | qualitel
Hi Dreamsniper, It seen this is the major issue had been occurs you.( We had face all this issue last time too) We had done a lot of areospace products before and most of ours products is a must on class 3 spec. BGA is not that tough t
Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS
Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl
Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
