Electronics Forum: speed[0] (Page 1 of 1)

missing component after placement

Electronics Forum | Wed Jan 26 21:23:51 EST 2000 | Dennis

Hello! all Will anybody give me advice for missing componets for 0402, 0603 R or C chips? I am not gonna tell you which machine I use, but from my experience, every p&p machine has possibility for missing component after placing 400 or more componen

Fine pitch paste release problems.

Electronics Forum | Fri Dec 20 04:07:25 EST 2002 | Roger

Although everything that has been said earlier is sound advice for achieving good printing results, I strongly believe your problem is your manual printer and its inability to accurately control the speed at which the PCB separates from the stencil a

Reflow oven

Electronics Forum | Mon Apr 24 04:23:56 EDT 2006 | TA

Hello guys, I am Looking for a oven with the following specifications. Can any one suggest me the best suitable model. Thanks ========================================================== - heating length 2500mm - zone top/bottom 7 - forced convection

Bubbles after coating

Electronics Forum | Thu Sep 20 03:31:42 EDT 2018 | minhhaioh34

Hi all, I need some pro help me with issue bubbles after coating. some information for some pro: Machine: Asymtek Chemical: Achime AVR80 Oven: IA 4 zoon4 ( setting 100 100 90 80 conveyor speed: 0.6 m/min). I had happened before and after the oven. W

Solder paste process

Electronics Forum | Sun Apr 26 08:36:55 EDT 2009 | davef

First, in direct answer to your question, DOE printer setup variables (MPM): * Squeegee speed: 0.5 to 1.0 in/sec * Pressure (metal): 1lb/in of blade * Pressure (plastic): 1.6-3 lb/in Second, supprting earlier responses, most people monitor paste hei

stencil printing parameters

Electronics Forum | Wed Mar 27 16:54:47 EST 2002 | davef

STARTING RANGES * Pressure � 1 pound/inch of blade (metal); 1.6-3 pound/inch (plastic) * Speed - 0.5 to 3 inch per sec [for standard pitch]; 0.5 to 1 inch per sec [for fine pitch] Your paste supplier�s recommendation is a good place to start. * Sepa

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