Electronics Forum | Wed Oct 08 11:16:12 EDT 2014 | cbeneat
We are having an intermittent issue with a certain board on our wave solder line, machine is a Vitronics 6922 Delta Wave, leaded process. There are 2 fuse holders on one edge of the board that are not getting solder all the way thru the barrel every
Electronics Forum | Tue Sep 18 13:09:21 EDT 2001 | jschake
Hey, where's the 0201s? Just kidding. Off the top of my head, I do not recall seeing results of such a test. Nonetheless, I�ll consult with my peers and let you know if we come up with something that could assist you. That said, with a few more d
Electronics Forum | Fri Oct 31 14:09:07 EDT 2014 | wbrenner
Having a problem with a DEK printer. In the back to front motion, getting poor ramdom paste volume on micro BGA pads. Other BGA 1 mm pads are fine. The front to back motion is fine. Any throufghts on this directional issue. Ran ~200 panels no pr
Electronics Forum | Wed Feb 23 22:56:46 EST 2011 | jeffr
When I enter the "Setup Table Contact" menu, then press "Load PCB" the squeegee head should move to a mid position that I can set the squeegee height, but instead it moves the squeegee head to the front limit and displays a red error message about th
Electronics Forum | Mon Jun 29 13:38:20 EDT 1998 | Russ Miculich
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian: As Justin says - the issues are many. However, a good start would be to run at 0.75
Electronics Forum | Tue May 28 08:32:41 EDT 2013 | emeto
Hi Eric, your problem looks like a printing issue - if the part(or group of leads) missing solder is always the same. I would say you should check: 1. Stencil for any damage at this area 2. Squegee for damages 3. Adequate pin support un der the boa
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
Electronics Forum | Tue Nov 03 11:46:52 EST 2009 | davef
Search the finee SMTnet Archives for previous posts on the topic. Here's a clip from on of those posts that may get you started. [snip] * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, availa
Electronics Forum | Wed May 19 16:02:32 EDT 2010 | remullis
I am currently experiencing major issues when printing fine pitch parts. Pad width is .008 Even starting with a new screen, fresh paste, etc. I see where the paste is not breaking away from the screen apts consistently and when inspecting the pads I
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
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