Electronics Forum | Fri Aug 07 08:53:32 EDT 2009 | zanolli
We are looking for a supplier for solder spheres -- must be a world class supplier for what could be a high volume requirment for .5mm dia spheres -- Any reccomendations
Electronics Forum | Fri Aug 07 11:15:15 EDT 2009 | davef
All major solder suppliers should be able to meet your stated requirements. Try: * Kester ; 515 East Touhy Ave, Des Plaines, IL 60018-2675; 847-297-1600 847-699-5548 kester.com * Heraeus Incorporated, Circuit Materials Div.; 24 Union Hill Rd, West Co
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann
To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h
Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann
To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h
Electronics Forum | Sun Oct 31 09:19:26 EST 2004 | Steve
I believe on High Temp. Spheres you require paste eutectic 63/37. The solder paste forms an intermettalic bond to the pad and a bond to the surface structure of the high temp sphere. The standard 63/37 alloy spheres will melt during reflow and form t
Electronics Forum | Tue Aug 25 10:25:56 EDT 2009 | grahamcooper22
Do you know the exact BGA sphere alloy make-up and the alloys melt temp ? Then you can judge the ideal reflow temperature. Also, does the package warp in the reflow zone ? This may be causing the solder spheres on the BGA to lift off the pcb and henc
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Tue Oct 07 10:23:35 EDT 2014 | reballer
I have been applying solder spheres to BGA packages. During the process, the spheres are run over a stencil for placement. The spheres tend to stick to each other (and clump), even away from the stencil pattern, when it is humid in the work area. I'm
Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin
I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg
