Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
Electronics Forum | Mon Jan 12 21:31:26 EST 2015 | warwolf
The closer your inspection the more defects you will find, the more rework you do the possible cost you will add and the potential increase of damage you could do to your products if rework is not up to a machine copyable standard. "Is there any in
Electronics Forum | Fri Apr 06 12:31:07 EDT 2018 | deanm
Your fluxes are required to be compatible per J-STD-001. I wouldn't even attempt mixing no-clean (rosin) and clean (assuming water soluble) fluxes on the same assembly, especially if the fluxes are from two different vendors. If your paste and liquid
Electronics Forum | Mon Apr 09 11:34:59 EDT 2018 | emeto
definitely don't mix clean and No clean. Run No Clean as you decided, but have your flux and paste manufacturers advice, how this flux can be cleaned(if you decide or required to clean). I know for a fact that some of these NC flux residues are almos
Electronics Forum | Tue Jan 06 13:26:47 EST 2015 | rgduval
I can't say I've ever heard that you shouldn't rework class 3 products. Since class 3 and class 2 are inherently inspection standards, rework might be required to meet class 3 specs. In the past, that has been an issue, as everyone wants to produce
Electronics Forum | Thu Apr 05 17:06:11 EDT 2018 | stephendo
We recently got a batch wash machine that can use a chemical cleaner. (not a saponifier). NOW I feel confident cleaning no clean boards. Without a machine that can heat water and use a proper cleaning agent, I would not trust cleaning no clean boards
Electronics Forum | Mon Mar 06 21:58:56 EST 2006 | kent_peterson
Good machine! Just like most part libarys don't let the operators change part profiles. Haven't seen it place 0201's but 0402's have no problem. Tape splicing for the feeders is a problem. The eject wheel gets jammed with anything other than splice t
Electronics Forum | Fri Jul 15 12:41:56 EDT 2005 | russ
You are not wrong in monitoring the Product (your really not monitoring the process). This methodology is valuable if your process is unstable (SPC is used to stabilize process). There is value in "real time" inspection of a process's product as lon
Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
Electronics Forum | Sat Mar 05 22:57:32 EST 2005 | gpaelmo
This has been our practice and its worked well: SMT process-QC/Touch-Up-Assembly. We have dedicated QC/T-Up after reflow trained under IPC requirements. They do the SMT inspection and ONLY touch-up if necessary. This way we never have to inspect SMT
winsouce.jpg)
.gif)
