Electronics Forum | Wed Apr 28 11:16:45 EDT 1999 | Steve Gregory
Hello all, I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area of th
Electronics Forum | Wed Apr 28 12:18:04 EDT 1999 | Scott McKee
| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area
Electronics Forum | Thu Mar 19 12:22:54 EDT 2009 | mhjohnso
While investigating a routing study for a new bga device, I found the vendor used round 20 mil pads on 0402 decoupling caps.This allows fitting the caps between break out vias on their 1mm pitch BGA. Round pad gives about 8 mils diagonally from pin t
Electronics Forum | Tue Jun 30 18:37:19 EDT 1998 | Earl Moon
| Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | I would appreciate if somebody could help me in the stated issue: | I am trying to to place one thru hole 20 pin connector along with the SMT components by paste pri
Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
Electronics Forum | Wed Jul 30 00:47:10 EDT 2014 | matusov
Hello gurus, I am a hardware designer with a small company. We are about to send a new PCB for fabrication. This board uses dozens of tiny QFN, DFN, and similar packages. As a final check I have been going through the datasheets of all these parts t
Electronics Forum | Wed Jul 30 11:36:31 EDT 2014 | emeto
About the pads shape - you can do rectangular or oblong. For stencil design oblong is better for small pads(0.2mm) because it will give better release, so having this thought in mind you should probably design oblong shape and then print make paste a
Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon
| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
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