Electronics Forum | Tue Aug 04 14:43:12 EDT 2009 | kpm135
Thank you very much SWAG that password did the trick. Got us into the calibration menu and we were able to calibrate the z-axis and snugger height and got it to work. Thanks again
Electronics Forum | Tue Aug 04 09:02:34 EDT 2009 | kpm135
We replaced the tactile sensor's linear actuator on a MPM Ultraprint 2000 HiE. Now we are getting a Tactile Hardware limit error every time we try to find the stencil height. I was hoping some one could explain why we're getting this error and any i
Electronics Forum | Tue Aug 04 10:19:38 EDT 2009 | swag
Here's a few ideas: If it has one, make sure the flexible coupler set screws are tight. Replace the tactile switch (often these appear to work fine in I/O but do not work properly in production). Clean and oil the tactile plunger if it has one. M
Electronics Forum | Wed Feb 23 22:56:46 EST 2011 | jeffr
When I enter the "Setup Table Contact" menu, then press "Load PCB" the squeegee head should move to a mid position that I can set the squeegee height, but instead it moves the squeegee head to the front limit and displays a red error message about th
Electronics Forum | Sat Apr 21 04:39:45 EDT 2012 | brotakul
I am using different equipements for SPI such as Koh Young and Cyber Optics machines. I am looking for implementing a general procedure (SWP) for setting LSL's and USL's on the products on which the customer does not specify any limits on the solder
Electronics Forum | Mon Jul 10 09:32:35 EDT 2017 | georgetruitt
You need to find a machine that has a camera with adjustable focal height. Fixed cameras can inspect most smt components but soon reach their limits when it comes to inspecting taller components like thru hole. Yes, there are many AOI machines out
Electronics Forum | Thu Dec 16 20:41:56 EST 1999 | TNT
Hey C.K, If you are looking for inspection of the solder paste before reflow, there are many types of inspection: 1.Paste height measurements at random positions 2.3D inspection with shadow contrast capabilities based on an autocad format 3.3D inspec
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
winsouce.jpg)