Electronics Forum | Tue May 19 20:14:08 EDT 2009 | davef
We use epoxy to repair damaged pads
Electronics Forum | Tue May 19 03:19:33 EDT 2009 | cunningham
Has anyone used a hot press to bond new pads to the boards if they have been lifted? we have one and have tried and carried out some DOE's on FR4 boards but when trying the same settings on Polyamide they basically fell of can anyone give any pointe
Electronics Forum | Thu May 28 03:18:22 EDT 2009 | cunningham
We use an epoxy method at the moment but the cure times are long with 4 hours oven cure and 4 hours air cure before solder can be applied to the pad the hot press bonds the already made epoxy pad to the board in less than 5 min and is ready to solde
Electronics Forum | Tue Feb 06 21:21:37 EST 2001 | davef
I know dip about your question. Try: Sri Venkat, Advanced Packaging & Interconnects, Coherent Photonics Group Laser Division, Santa Clara, 408-764-4446 sri_venkat@cohr.com
Electronics Forum | Tue Oct 21 06:33:18 EDT 2008 | maheshbs
Dear stany, sry for wrong reply.
Electronics Forum | Mon Mar 26 16:33:54 EDT 2018 | jacobidiego
I realize that I wrote wrong. Sry The stencil of 0,1mm of thickness is printing 45% more volume. I know this becouse the SPI is setup with the stencil gerbers and the messurements have a median of 145% of volume. what do you mean with excesive sold
Electronics Forum | Thu Mar 30 06:52:47 EST 2006 | smartasp
Hi Guys Just received a second hand (1998) MPM UP2000 Paste printer. Can anybody let me know about the tricky issues (not in the manual) to look for and what are the common spares we should have on stand by. Should we have an expert helping us inst
Electronics Forum | Thu Nov 24 21:19:40 EST 2005 | smartasp
Hi, We are also a hig mix low volum plant situated in Sri Lanka and just installed 2 Opals inline from Assembleon with the feeder exchange carts for faster change over. This machines can be upgraded to Topaz by just installing 4 more heads. So far
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