Electronics Forum | Thu Sep 12 15:23:06 EDT 2002 | soupatech
I amusing a Fuji CP3. The part data seems to be the easiest part for me, 3x3 square. I went with the 2mm and had LOTS of dropped parts. A 1.3mm worked MUCH better, between 1 and 2% loss. My only problem now seems to be profiling the oven. The specs o
Electronics Forum | Thu Sep 12 16:17:07 EDT 2002 | soupatech
There seems to be less play in the pocket than with other parts i've loaded. I was assuming the large nozzle would work better but for reasons unknown to me it didn't. I also tried a 1mm and had parts all over the machine (can you say hand place 100+
Electronics Forum | Tue Mar 01 11:11:50 EST 2005 | spot
We use SRT. We still have machines that are over 5 years old and are functioning very well in the BGA, QFP and yes CSP area. The critical part is getting the right Air nozzle for the part size. Also the software has a auto-profile feature that wor
Electronics Forum | Tue Oct 31 19:56:18 EST 2000 | Massimo
I'm reworking BGA with a "SRT Summit 2000". This machine uses a nozzle of the same size of the BGA to conduct nitrogen to the top of the BGA. When I rework big PBGAs (318PBGA, 388PBGA) I've got shorts at the corners (100% of the times!). I think the
Electronics Forum | Mon Dec 10 13:26:40 EST 2012 | dyoungquist
We are using our selective solder machine to solder a backplane with sixteen (16) 4x48 pin 0.080" connectors. Our first pass yield is about 85% meaning that 85% of the connectors come out with no bridges. Not quite as fine pitch as your connector a
Electronics Forum | Wed Jan 23 22:30:46 EST 2002 | Jones
The CP-65E handles a wide range of board sizes, including large boards up to 508 x 457 mm or 20 x 18 inches. Handling consumer as well as industrial applications, this durable and highly efficient machine achieves a cycle time of 0.12 seconds/shot an
Electronics Forum | Thu Dec 06 12:37:14 EST 2012 | deanm
We are having difficulty with bridging on a 2x50 pin 0.050" fine pitch connector using our selective soldering machine. It usually bridges at the end of the row, but sometimes it bridges all the pins together as it drags across (solid bridging). I
Electronics Forum | Thu Jul 04 17:48:28 EDT 2024 | assuredtech
I don't know who manufactures the SMT 460 machine or what it's capabilities and configuration or machine settings are applicable to this topic but some common process of eliminations are: Component packages (doesn't seem to be an issue here), Board s
Electronics Forum | Mon Oct 28 07:07:39 EST 2002 | cyber_wolf
It has been my experience that when all conditions are as they are supposed to be there should be zero or very little deflection. When you start placing components with pick and place equipment that does not have a Z pressure sense, you run the possi
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
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