Electronics Forum | Tue May 02 16:37:16 EDT 2017 | travishemen
Our customer wanted us to stack two chips but I convinced them to let us place them side by side on the same pads. It had the same effect. They were 0603 size components and the pads were big enough that they still passed IPC for solder quality. I
Electronics Forum | Wed Sep 03 07:39:19 EDT 2008 | pjc
You may not be getting enough exhaust pull, so the cooling modules over temp. Try swapping blower motors to isolate that before buying one. STANDARD AIR OPERATION: - Load-end: 150 cfm (255 m3/hr) at the 4� (102 mm) stack (minimum requirement) - Unlo
Electronics Forum | Fri Sep 10 09:03:52 EDT 1999 | ScottM
| | hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the prec
Electronics Forum | Tue Apr 11 16:11:06 EDT 2000 | John Thorup
Hello Ashok I can't recall mask damage through normal handling that did not have an adhesion or cure problem as its root cause. Most of our boards arrive shrink packed in groups of 10. We simply pop off the wrap one pack at a time and leave them in
Electronics Forum | Fri Feb 23 10:24:24 EST 2001 | johnthor
We still build a legacy product with a primitive backplane using silver plated fork terminals for outside world connections. After some 20 years of no problems the fork terminals on raw stock PCBs were black and almost unsolderable. Because of the
Electronics Forum | Sun Nov 14 11:45:08 EST 1999 | Jeff Ferry
Back to Wolfgang's original request. Stacking chip components is just one of many unusual mods that are being added to IPC 7711 Rework of Electronic Assemblies. While some may deem this technique unacceptable, it is a relatively common practices
Electronics Forum | Fri Jul 23 02:54:47 EDT 2010 | wizzkid
I think that it can be solved by placing ths into a baking oven with the set point above the PCB Tg. For this process to be succesful, weights need to loaded onto the PCB stack during the heating cycles. Once the cycle is complete, the PCB stack will
Electronics Forum | Wed Aug 18 02:17:37 EDT 2010 | tennythomas
I heard that one can create the stacked/staggered microvias in the layers 1-2 & 2-3 and skip microvia in the layer 1-3 of 6 layer stack up, when the prepreg is between layers 1 & 2 and the other prepreg is between the layers 2 & 3. I want to know w
Electronics Forum | Wed Jul 22 06:58:50 EDT 2015 | migliore
Hi, I got the answer from edaboard.com A standard 6-layer stack is using 2 cores. Manufacturing steps for standard 6-layer are: 1. Etch both (double side) core substrates 2. Assemble, press and cure the complete stack: - copper foil - prepr
Electronics Forum | Thu Apr 07 19:17:43 EDT 2022 | cbart
Good afternoon The ISI I was mentioning is interconnections solutions which is a division of Molex. a few years back we ran into a component end of life situation but had thousands of very high dollar bare boards in stock. the package was a BGA and w
