Electronics Forum: stack (Page 10 of 24)

Re:Diff. Epoxy resin (ER) conformal coating Vs ER adhesive bonding matrl

Electronics Forum | Wed Oct 04 14:46:46 EDT 2000 | Kal. Chak.

Hi folks, What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have chec

Re: wafer to waffle

Electronics Forum | Wed Sep 13 07:17:32 EDT 2000 | Paul Gerits

Dear Sir, It is possible depending on the exact application. At the moment only way to go direct from die to waffle or PCB is with Hover Davies direct die feeders on Philips EMT (ACM, advanced component mounter), Universal and Siemens machines. This

Re: Stacking chips

Electronics Forum | Thu May 18 13:08:33 EDT 2000 | Wolfgang Busko

Chris, one question, which standard allows to put it in the drawings/dokumention? As I said in my old IPC-D-275 it says "no". Did it change with the new edition ? Referring to J-STD-001 in this case seems to me like "I followed only the orders and do

SMTnet 2.0

Electronics Forum | Mon Jan 15 20:47:26 EST 2001 | davef

On the "Main Conference" page there's a series of columns. Column 1 contains notices and adverts Column 2 contains unselectable icons that looks something like a stack of pages Column 3 contains circles the turns red when selected Column 4 contains t

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 15:44:50 EST 2001 | pteerink

I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so my pass spec, although they are not pret

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 15:45:20 EST 2001 | pteerink

I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so mine pass spec, although they are not pr

Mydata vs Siplace

Electronics Forum | Mon Apr 23 11:06:32 EDT 2001 | pteerink

I had a couple of Mydata's for a number of years. I loved the software, it was easy to use, easy to program, easy to learn and very flexible. It's design is suited more for "batch" style production, rather than inline production. The placement is rel

Paste In Hole

Electronics Forum | Mon Jul 09 14:03:39 EDT 2001 | ohboy

Make sure you're getting a good roll from your squeegies. Poly will "scoop", leaving less, nickel will add a little extra. A slightly shorter blade height out of the holders will help promote a good roll- this helps push the paste into the thru h

Inspection Methods

Electronics Forum | Sat Jul 21 09:46:41 EDT 2001 | davef

I was reading something in the paper this morning where the police have found that having a witness look at six pictures of suspects laid-out on a table [the six pack method in their parlance] is more error prone than just looking through the stack o

Re: Solder Paste

Electronics Forum | Sat Jan 24 00:13:57 EST 1998 | Scott

| What is the lifetime for a typical solder paste ? | How long can boards be stacked waiting before the paste goes off ? Lifetime and tack time depends on: - Manufacturer - Flux/mixture - Environmental conditions Typical lifetime is dependent on stor


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