Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Sat Sep 25 09:18:40 EDT 1999 | Steve E ( Fuji America )
| Question for you SMT guru's out there. | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: | | 1.
Electronics Forum | Wed Sep 22 09:25:42 EDT 1999 | Wolfgang Busko
| | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the scree
Electronics Forum | Thu Sep 23 17:31:12 EDT 1999 | DaveH
For another excellent vendor try EMC GlobalTechnologies in Pennsylvania (215)340-0650. Contact Marty Wetzel. | | | | | | any thoughs? | | | | | | thanks | | | | | | | | You should use pallets that stand the reflow as well so that no separation wi
Electronics Forum | Thu Sep 16 03:16:21 EDT 1999 | Brian
| Good people, and bad or otherwise afflicted, | | For those of you having enormous time avaialable to read my rantings in the SMT Express, please pardon the font situation. It ain't my fault, maybe, and Mike is not to blame. Something gets lost in
Electronics Forum | Tue Aug 31 19:16:59 EDT 1999 | Steve Surtees
| I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average ram
Electronics Forum | Tue Aug 31 20:41:45 EDT 1999 | Dreamsniper
| | I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average r
Electronics Forum | Sat Aug 21 12:29:28 EDT 1999 | Brian
| I have a layer of electroplated solder (10/90) that appeares to have some sort of contaminent on it. Water will not wet to the layer in some areas. I have tried using 10% HCl in DI as a cleaner as well as 7.5% Fluoboric acid in DI. Neither has t
Electronics Forum | Thu Jul 29 15:44:29 EDT 1999 | Earl Moon
| Thanks Earl for your insight! I sometimes feel conspicuous as one of the few women I've seen frequenting this board, but everyone's been helpful and has resisted the overwhelming temptation to pat me on the head. | | From what you and some of the
Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park
Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?
