 hitech.gif)
Electronics Forum | Fri Sep 11 10:52:25 EDT 1998 | Javier Carrera
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Fri Aug 14 12:43:10 EDT 1998 | Upinder Singh
| Electrical Eng. is looking for 5 micrograms per sq centimeter. After the board has been cleaned. Is this possible on a fully assembled bd? Yes, u can go to the mentioned level of cleanliness.....but can u be a bit more elaborative. Recently I did
Electronics Forum | Wed Jun 24 16:44:27 EDT 1998 | Gerryr
| We have a need to manually insert, cut and clinch a radial part that is prep close to spec on a board traveling down a standard conveyor. Is anyone aware of such a system? I only know of regan off line. There is a system called a clinch master by
Electronics Forum | Thu Jun 18 09:26:38 EDT 1998 | Maurice McClain
WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATURE S
Electronics Forum | Wed Jun 17 14:11:31 EDT 1998 | Dave F
| Is there any industry standards regarding shelf life for components? Also do they very between component type packaging? | Thanks No, but generally, the shelf life of components depends on the environmental conditions of the storage area. So, in a
Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon
| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over
Electronics Forum | Tue May 26 07:42:54 EDT 1998 | Chris Sargent
Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint stre
Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond
I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether
Electronics Forum | Sat Feb 28 14:00:18 EST 1998 | Gary Simbulan
I have run across reference to EIA-481 for specifications on Tape And Reel components for automatic placement and am looking for something similar that specifies standards or dimensions for IC Tubes or sticks. I am trying to make the vibatory feeder
Electronics Forum | Thu Mar 19 17:02:50 EST 1998 | TaeDong Park
| I have run across reference to EIA-481 for specifications on Tape And Reel components for automatic placement and am looking for something similar that specifies standards or dimensions for IC Tubes or sticks. I am trying to make the vibatory feed
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
.gif)
