Electronics Forum | Thu Oct 03 04:04:10 EDT 2002 | Bob Willis
SMTNet has a video tape and interactive CD ROM on Intrusive Reflow Soldering that you may want to check out. In addition there are some free inspection standards for pin in hole printing, placement and soldering available at http://www.dpmo-monitori
Electronics Forum | Thu Oct 03 09:53:08 EDT 2002 | Jim Gryga
I am looking for a software package that can provide me with a ballpark estimate of labor time required to assemble electro-mechanical products. The inputs that I imagine would include number and size of fasteners, number of wire connections, number
Electronics Forum | Mon Oct 21 08:46:15 EDT 2002 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohi
Electronics Forum | Wed Nov 06 19:59:39 EST 2002 | davef
Consider checking with your CC materials supplier for suggestions. It's to their benefit to help you do a good job using their product. Regardless of your current requirements, consider basing your workmanship on NASA-STD-8739.1 Workmanship Standar
Electronics Forum | Mon Dec 02 20:53:29 EST 2002 | davef
Gerber[R] Data (File). Used in directing a photoplotter during printed circuit board and stencil artwork fabrication. Gerber Scientific Instrument Company used to be the dominant producer of the photoplotters used for "shooting" film, back when mec
Electronics Forum | Wed Dec 18 20:08:36 EST 2002 | jonfox
Are your components not in JEDEC trays? We use Kostat trays and we can bake our parts at or up to 150C. What are your temperature requirements, and what are your parts currently being stored in or on? There are a slew of tray makers out there that
Electronics Forum | Tue Jan 07 15:14:25 EST 2003 | russ
What exactly are you concerned about? This is from what I can see a pretty standard part (30 mil pitch, 17mil ball). Sorry, I have to convert to inches for my weak brain to work! This part should process very well. Russ
Electronics Forum | Thu Jan 30 14:37:45 EST 2003 | davef
NASA-STD-8739.1 , Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies, says words to the effect of : 10.1 Purpose Conformal coatings are intended to provide electrical insulation and environmental
Electronics Forum | Tue Feb 25 20:10:33 EST 2003 | davef
First, there is no standard. Next, on one hand, most BGA cost a lot of money. On the other hand, choosing to use reballed BGA in products for shipment depends on how well you expect to meet your customers' expectations about product reliability wit
Electronics Forum | Wed Feb 26 21:44:52 EST 2003 | Paul Dansereau
I will be building a board, about 8 X 12 , .062" thick using a standard FR406 stackup. It has a variety of devices, including CCBGA , CBGA and PBGA's. Given the challenge of developing a reflow profile that will accomodate both ceramic and plastic BG
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