Electronics Forum: standards (Page 275 of 360)

Solder paste dispenser choice

Electronics Forum | Wed Oct 15 16:34:36 EDT 2008 | gregcr

Hi All, I am retrofitting a machine with a solder paste dispenser head, and am trying to decide what direction to go, with a dispense valve. The choices I know are either a standard Air over, or some kind of positive displacement valve such as a sc

Dealing with TH Barrels on Bds w/Heavy Ground Planes

Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef

A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta

Solder Paste Storage and Control

Electronics Forum | Thu Oct 30 11:34:51 EDT 2008 | davem

Guys, So I recently started working for a small CM in Southern N.H. We currently use 2 Magic Chef Mini wine friges to store the solder paste (63/37, RoHS). I've been monitoring the room temp (and humidity) and the frige temps all this week. The pro

Fuji cp43 pcb layout

Electronics Forum | Thu Oct 30 21:06:20 EDT 2008 | ashley

Hello mickd, For Fuji practice, the primary tooling hole preferably be 5mm from the edge of the PCB (lower right hand corner). This is the reference X0, Y0 co-ordinates in the Fuji program where placing co-ordinates going LEFT will be -ve value & go

Delamination / Measling

Electronics Forum | Sat Dec 13 17:46:27 EST 2008 | ysutariya

If you're military then you're probably just needing standard 130Tg FR4 and tin-lead finish. I would check two things: 1. Bake temperature: Isola recommends 300F for 4 hours to drive moisture out. Lower baking temperatures do not require a linea

Epoxy for holding large inductors

Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman

We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als

Soldering problem with Au plating PCB

Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter

Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became

Calculating Mydata angels with CircuitCam

Electronics Forum | Fri Mar 06 12:23:39 EST 2009 | stepheniii

Are you working for an OEM? If so see if you can get your engineering department to change their "zero orientation" for the packages. At one place I believe the CAD department called them "G codes". What was really bad there was that one shape had

Mydata linear stick feeder

Electronics Forum | Fri Oct 01 00:49:33 EDT 2010 | darrenj

Yes, we have the Agilis stick feeder and it is a definite improvement on the vibe. It usually comes with a set of starter 'tubeforks', but i bought another starter set after a while since the individual tubeforks are relatively expenisive. Always g

SOLDER BALLS

Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef

Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu


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