Electronics Forum | Mon Sep 17 17:33:38 EDT 2012 | kq702
thank you for your reply. I felt like I was using too much heat but I thought it would not work unless I did so. I did not suspect a cold solder joint, however I did another test on a scrap board. I heated the board without my clamps attached (I put
Electronics Forum | Tue Sep 15 07:54:42 EDT 1998 | Rob Fischer
| | I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | | The problem h
Electronics Forum | Thu Apr 03 11:57:38 EST 2003 | davef
R4: We see the ball left on the PCB with a flat top and the BGA pad appears to be virgin. D4: Not good. The flat top indicates that the ball melted at one time or another. This pad and ball have seen at least two solder cycles with solder and flux. S
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory
| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T
Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon
| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?
Electronics Forum | Tue Jun 10 16:51:19 EDT 2003 | davef
Develop your recipe wave soldering exactly as you developed your recipe for reflow soldering. The only difference is that instead of using your paste supplier's recommendations as the starting point, use your flux supplier's recommendations as a bas
Electronics Forum | Wed Mar 29 16:25:55 EST 2006 | Tech
Find you a good degreaser to clean the clutches with. Fuji used to ship Threebond with the machines but quit due to negligence on the part of the users if I had to guess. I believe the number was Threebond 2706. Now make sure you take a shop rag or s
