Electronics Forum | Wed May 15 15:58:11 EDT 2013 | rgduval
Let me see if I understand you correctly. You have a batch washer (looks like a dishwasher). There is a top and bottom spray fixture, which would normally spray water up at the board and down at the board being washed. When you place boards in t
Electronics Forum | Thu Oct 23 09:45:05 EDT 2014 | rgduval
Generally, excess solder balls found randomly around the board/parts points to either a dirty stencil during printing, or a stencil/board that is shifting during printing (smearing the paste a little, and causing a dirty stencil. If the apertures ar
Electronics Forum | Wed May 20 16:07:22 EDT 2020 | stephendo
You want a big enough storage tank to smooth pressure. Figure out what size pipes you need and go a size bigger. Make a loop of the pipes with shut offs. That way you can shut down any section and still have air to the rest of the air line. Run the p
Electronics Forum | Mon Apr 19 21:37:17 EDT 2021 | ouaret
dear all, update: we got that the calibration of SIM is the problem, the distance between SIMs need to be calibrated. can someone help us get the manual that describe on how to calibrate the SIMs? we have a problem with our cyberoptics AOI machine
Electronics Forum | Thu May 06 18:06:43 EDT 1999 | JohnW
| | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | Thank you vey much. | | | | rdgs... | | | Typical depends on the processes you're developing. | | Key factors in my experience are flux type and requi
Electronics Forum | Thu May 06 18:07:59 EDT 1999 | JohnW
| | | Can anyone pls email me a typical temperature profile for wave soldering process. | | | | | | Thank you vey much. | | | | | | rdgs... | | | | | Typical depends on the processes you're developing. | | | | Key factors in my experience are f
Electronics Forum | Thu Mar 15 15:36:39 EST 2001 | traviss
Don�t be afraid of the more standard doubles sided mixed process. Even without a chip wave it works, don�t get me wrong it works better with the chip wave, but even without chances are you will be spending more on the additional steps than you would
Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon
| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess
Electronics Forum | Sat Mar 06 10:25:55 EST 1999 | Earl Moon
I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting about 60% success using this rewo
Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
