Electronics Forum | Fri Jan 03 12:01:46 EST 2003 | jax
Alot of the companies out there use Standards developed internally, centered around there paste, equipment, and reflow processes. Normally you will see either 5mil or 6mil stencils used for everything in house with the exceptions of specific boards.(
Electronics Forum | Fri Jan 03 11:42:38 EST 2003 | soupatech
Hi, I am loading a new board with mostly 0603 packages. The pads are .5 mm apart and I am having a big problem with parts shifting towards eachother instead of centering on the pads. I believe this is caused by too much solder. I am using a 7mil sten
Electronics Forum | Thu Jan 09 10:58:30 EST 2003 | soupatech
Thanks for the input.... I ordered a 5 mil stencil AND used more tooling under the board. This gave me a much smaller deposit of solder. I wouldn't swear that was my problem but 96 boards later the problem is 99% gone. I believe there was just too mu
Electronics Forum | Thu Jan 09 10:47:36 EST 2003 | Hussman
Depends on what you mean by shifting towards each other. Otherwise, 7 mil should be fine for 0603. I've used 6mil, 7mil and 8 mil without problems. Generally, stencil thickness won't have a bearing on "shifting" parts. Check placement. Make su
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Wed Jan 15 03:06:15 EST 2020 | SMTA-Davandran
Hi anyone, have standard design guideline for all type of components.
Electronics Forum | Wed Jan 15 06:58:51 EST 2020 | dontfeedphils
http://www.ipc.org/TOC/IPC-7525.pdf Best place to start.
Electronics Forum | Mon Jul 12 21:05:06 EDT 1999 | karlin
Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) Secondly, I need also facing a lo
Electronics Forum | Tue Dec 21 18:09:24 EST 1999 | Brian W.
I have been soldering 0603 components on the bottom side using a glue and wave solder process for a long time. Bridging has not been a common problem. However, it is inherent on the design engineers to follow good manufacturability planning when la
Electronics Forum | Mon May 27 07:16:27 EDT 2013 | mskler
We have an LED 0603 package, We are using stencil of 5 Mil, Before Reflow placement is perfact but after reflow it tis found that there is more than 30% LED are tilt. Can the speed of Fan in Reflow can help or I have to reduce the PAD opening in Sten
