Electronics Forum | Thu Mar 17 09:36:42 EDT 2011 | swag
We inspect incoming stencils to see if they are labelled properly and sometimes check the width of special apertures and that's about it. We want to kick it up a notch. What are others out there doing to inpect incoming stencils? Is there criteria
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Wed Aug 07 17:20:17 EDT 2019 | orbitcoms
The aperture over the pads is set to 95% coverage of the pad. The stencil is 0.12 mm thick.
Electronics Forum | Thu Apr 21 19:41:35 EDT 2016 | adamjs
Hi, is there some sort of gas (certainly refrigerated, possibly pressurized?) in which printed boards can be stored to extend the allowed time between SMT paste printing and placement? Or other technique for achieving this? Background: we're a smal
Electronics Forum | Sun Apr 26 08:36:55 EDT 2009 | davef
First, in direct answer to your question, DOE printer setup variables (MPM): * Squeegee speed: 0.5 to 1.0 in/sec * Pressure (metal): 1lb/in of blade * Pressure (plastic): 1.6-3 lb/in Second, supprting earlier responses, most people monitor paste hei
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Wed Aug 16 13:29:51 EDT 2006 | SWAG
Is 811 lead paste? If so, it seems to me that your oven settings are getting into soak awful fast in zone 2 and your peak is way high. Unless you are doing a thick board or something like that, those oven settings seem aggressive and might result i
Electronics Forum | Mon Jul 22 10:37:06 EDT 2013 | torch
we have been asked by a client if we are capable of producing product that will require HMP, I am currently tyring to gather as much info as I can with regards to this solder type and would like help can we run this type of solder through a smt line
Electronics Forum | Fri Nov 30 23:28:54 EST 2007 | mika
BTW, Option 6. Bear in mind though, In the stencil printer if you run into a problem like this, it will not work with the holes...Only what's in the stencil... We have under some rare circumstances used 1-2 pad's on opposite corners and on very large
Electronics Forum | Wed Jun 14 09:34:25 EDT 2017 | cyber_wolf
In my experience there is no need for wet wiping stencils. We run 0201'and micro BGA's daily with no issues. If you are having paste release issues, I would be looking at other things. Aperture area aspect ratio, aperture design, land design, sold
