Electronics Forum | Thu Apr 19 11:04:43 EDT 2001 | Spanky
All, We are getting ready to start running with 0201 passives. I have never run these before. We have run some 0402s however. We don't have any assemblies in-house yet, so I can't give any intelligent information regarding the board design (size,
Electronics Forum | Thu Sep 02 15:45:35 EDT 2004 | russ
We don't do any wave, SMT only. We did not have to change apertures for lead free, we use the same stencil that we did when we ran water soluble with pb. This I think might be dependant upon your current design of both pad and apertures however.
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Tue Aug 01 08:52:53 EDT 2006 | davef
We never changed any thing after moving to imm silver. "Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release bette
Electronics Forum | Tue Jul 21 10:36:31 EDT 1998 | Justin Medernach
| | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment you
Electronics Forum | Mon Aug 03 20:07:37 EDT 1998 | Dave Kalen
| | | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment
Electronics Forum | Fri Oct 11 16:17:17 EDT 2013 | scdunlap
In your experience, what is the most popular CAD > package in use today? > > Also, does anyone have > an automated and/or quick way of counting the > solder points on an assembly based on either > gerbers or CAD data? We use GCPrevue to view
Electronics Forum | Wed Aug 16 05:20:29 EDT 2000 | Wolfgang Busko
Richard, take a given volume and weigh it. For your parts you have already determined the aperture opening and stencil thickness and that gives you the volume for each lead of the component. This way you should be able to determine the amount of pas
Electronics Forum | Mon Apr 10 09:48:43 EDT 2000 | Dave C.
John, having worked at a major U.S. telecommunications co. I can tell you we were placing through hole connectors in SMT. Using MPM printers 3000 2000 AP36 AP24. We opened the apertures on the stencil 25% over lead diameter to allow more paste(it wou
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
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