Electronics Forum | Wed Jan 30 03:01:39 EST 2019 | robl
You could use a stepped stencil around the parts you're having issues with to add a greater paste deposit to them and not the rest, or slightly elongate the apertures and overprint, but this may lead to solder balling.
Electronics Forum | Sat Dec 12 12:03:59 EST 1998 | Dave F
| DO you know of an Industry Standard that describes solder paste geometries requirements? | Lyle: The industry standard that describes solder geometries requirement is IPC-A-610. There is no industry standard that describes how solder paste shoul
Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE
| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n
Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker
You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a
Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar
Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res
Electronics Forum | Mon Jul 26 12:55:08 EDT 1999 | Rob Fischer
I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effective
Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William
All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Thu Jun 18 12:15:58 EDT 1998 | Bill Schreiber
Dear Maurice, Alcohol is a very "vertically oriented" cleaner. It cleans only a selected few types of solder paste. There are also numerous reports of fires and explosions associated with alcohol stencil cleaners. Plus, alcohol stencil cleaners us
Electronics Forum | Thu Jul 12 10:32:59 EDT 2001 | Hussman
Wow, what a string of answers and nobody brought up the easiest way to eliminate solder balls. Yes, the paste being squished under the part does reflow and work it's way out to the side during reflow. I did a 5 week study on this (when I was a bori
