Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef
Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc
Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Fri Sep 25 16:47:57 EDT 2009 | esoderberg
0.5mm pitch QFP's are typically mixed with large components on all of my boards. I usually use a 6 mil stencil with a minimum aperture width of 10 mils. Normal aperture size is 10 x 50 which causes shorts about 20% of the time. A recent purchase of
Electronics Forum | Mon Jan 23 22:53:31 EST 2012 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark
What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended
Electronics Forum | Fri Mar 07 21:02:21 EST 2003 | neil
When printing below .5mm pitch, the recommended stencil thickness is 5Thou, laser cut. Do not use any reduction and ensure wherever possible the pad to space ration is 1:1, the length of the pad is not as important as the gap between adjacent pads. T
Electronics Forum | Fri Mar 07 14:09:16 EST 2003 | davef
Q1: What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. A1: We've talked about this previously here on SMTnet, for instance check the fine SMTnet Archives: http://www.smtnet.com//forums/index.cfm?fuseactio
Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
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