Electronics Forum | Wed Mar 30 14:56:13 EDT 2016 | jsouth
We bought an ekra x5 at auction and the hard drive was pulled (due to the classified nature of the boards the company was producing)... i was told if i could find some one willing to make a clone of their hard drive (we are willing to supply the hard
Electronics Forum | Thu Aug 21 09:34:57 EDT 2003 | davef
Woa. The more paste that you put a a BGA ball, the more likely that you'll bridge between balls. Why do you need to compensate for the size variance in BGA balls? How does using a 8 thou thick stencil to compensate for ball size variance? Fine pi
Electronics Forum | Tue Jul 29 07:24:03 EDT 2014 | jandon
I think you need step on the bottom side of the stencil (undercutting) only to compensate elevations on the top side of the PCB, such as labels.
Electronics Forum | Wed Aug 20 21:30:56 EDT 2003 | paulm
Our company if currently reviewing our BGA Screen Printing Process. The problem we are trying to eliminate has to do with BGA Ball Size Variance. Some of our vendors are allowing a +/- of 0.004" in ball size. This would allow for the possibility of a
Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef
Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr
Electronics Forum | Mon Jun 29 13:38:20 EDT 1998 | Russ Miculich
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian: As Justin says - the issues are many. However, a good start would be to run at 0.75
Electronics Forum | Wed Feb 05 21:05:38 EST 2003 | davef
Iman On your situation: As an earlier poster stated, your options are limited to opening you stencil aperture to compensate for the paste lost to the via. On your designer's belief that "it helps in heat dissipation": Could be true, but: * Hole wil
Electronics Forum | Wed Apr 08 01:43:49 EDT 1998 | Clint Meech
We currently screen print glue for our bottom side components. We are looking to get the bottom side of one our boards screened with a solder resist (to cover mounting holes, etc, for the wave-soldering process). This would create an uneven surface
Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon
As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin
Electronics Forum | Wed Apr 08 11:30:03 EDT 1998 | mpark
Clint, You may want to call KJ Marketing Services, a Canadian company that fabricates plastic laser cut stencil. They call it "Kepoch stencil" This material was originally developed by Dupont, and patented and marketed by KJ. It was available for
