Electronics Forum | Wed Feb 22 08:02:56 EST 2006 | dj44
I was looking for an stencil design for a 0.5mm pitch uBGA. Pad size is 0.38mm in diameter. We have been using 5mil stencil with type 3 no clean paste. What size aperture should we be using? Any suggestions?
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Wed Jul 17 10:59:26 EDT 2002 | fraser
Piece of cake, our sencil design software not only automaticaly mods the data for all component pitches but can apply anti solder ball designs ( homebase, form4 vnotch etc). As an added bonus it warns when the side wall to surface area ratio exceeds
Electronics Forum | Wed Feb 22 10:00:58 EST 2006 | dougs
We've just set up a couple of products with 0.5mm pitch uBGA devices on them, i went for 5thou thick, laser cut nickel (to aid paste release) square pads same size as the diameter of the uBGA pads. Or you could go to a 4 thou nickel stencil, better
Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp
I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us
Electronics Forum | Wed May 10 01:00:09 EDT 2000 | gary
0.65mm pitch QFP. I believe that this is the borderline for Fine Pitch. Will I have a good paste release with Chem-etch matched with a rubber squeegee? I'm planning of a 15% reduction on the Width and no reduction on the length. Any feedback whether
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
