Electronics Forum: stencil gasketing (Page 3 of 9)

Re: OSP surface finish.

Electronics Forum | Thu May 25 11:51:12 EDT 2000 | AF Ng

Hi,Wolfgang Busko, Thank you for your help. Still need some advice. If the OSP board having stencil rest on the solder mask, then, would it has more gasketing effect( solder paste squeezed out to the underside of the stencil), as compared to the HAS

Fine pitch paste release problems.

Electronics Forum | Sun Dec 22 06:00:54 EST 2002 | Mark

Hi: Your stencil specs are good; Did you check the stencil thickness? It would be worth a ck since there may be an error from the stencil mfr If the paste is not releasing with good stencil specs, these are possible causes: 1 The paste isn't tou

gerber data vs bare board

Electronics Forum | Sun Sep 12 09:40:04 EDT 1999 | Wayne S.

hello having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would they do that

Stencil Printing for MPM model # SPM

Electronics Forum | Sat Mar 17 15:12:33 EST 2001 | robhal

First thing to check is that you have a good gasket between the PCB and the stencil (if not check that the tactile is free of paste at the base of it and calibrate the tactile. I am assuming it is not a head mounted tactile) Also check that the wipe

Fine Pitch Printing Issues

Electronics Forum | Thu May 20 16:30:50 EDT 2010 | mikesewell

I believe industry standard is 1/2 pitch for fine pitch devices. If your part is 20 mil pitch, apts would be 10 mil wide. This should gasket fine to the pcb pad and with a 5 mil stencil should print well.

Solder Balls

Electronics Forum | Tue Apr 30 07:49:38 EDT 2002 | johnw

shawn, define what you mean by solder ball's scattered across the board? I'd tend to agree with the thoughts of too much paste on chip's but normally your ball's would be mainly around these devices although som can move around depending on the surf

SMT on rig-flex and multi-flex boards

Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron

Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da

Solder balling under passives

Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch

Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 12:06:18 EDT 2023 | calebcsmt

Please elaborate, as I have already tried to rule out printer setup. 0 contact of course, ive tried a multitude of pressures, separation speeds, cleaning frequency. Moreover, i use these settings for similar stencils and have absolutely no issue

Aperture Adjustments and Etch Compensation on Arrays

Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon

As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin


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