Electronics Forum: stencil gasketing (Page 6 of 9)

No such thing as a Compact Reflow Oven?

Electronics Forum | Mon Mar 19 09:37:01 EDT 2018 | spoiltforchoice

Another critical part of a process with a large board is support. Most commonly this is a bed of pins e.g something like red-e-set but there are other solutions. Support with a large panel will be critical for printing to get a good gasket between PC

Re: 20 mil qfp bridging

Electronics Forum | Tue Aug 17 10:41:13 EDT 1999 | Steve A

Wayne, Sounds like a gasketing problem. When the horizontal apertures are bleeding but not the vertical apertures. Could be poor underside support, HASL miniscus issues, masking or plugging issues, but what many people do not account for is that t

Re: Stencil Cleaning

Electronics Forum | Fri Mar 12 13:30:06 EST 1999 | Bill Schreiber

Dear Scott, You are correct in questioning the chemistry portion of the process. However, I am couriuous as to why you selected DEK as a stencil cleaner. The most important part of any cleaning process is always the chemistry. How you deliver the c

Re: Stencil Cleaning

Electronics Forum | Fri Mar 12 13:40:53 EST 1999 | Bill schreiber

In a nutshell, you should be looking for a chemistry first, then look for a machine. Hopefully, they will be from the same source. | Dear Scott, | You are correct in questioning the chemistry portion of the process. However, I am couriuous as to w

Fine pitch paste release problems.

Electronics Forum | Wed Dec 18 12:04:53 EST 2002 | slthomas

That issue (gasketing is what I usually see it called) was the driving force behind us getting new printers. Our old semi-auto clamshells just weren't repeatable enough, particularly over changes in squeegee travel direction. If the paste in the

Re: Screening adhesives

Electronics Forum | Sun Sep 27 13:32:59 EDT 1998 | S. Evers

| | I am looking for anyone out there that has had experience with stenciling with chipbonder adhesives. I need information on material and stencil design. | The firm who can help is K&J marketing their new KEPOCH stencil material is a (plastic) pol

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Mon Mar 09 16:36:38 EST 1998 | Jim McLenaghan

| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need

Re: Soldermask Design Rules

Electronics Forum | Wed Jun 14 12:43:52 EDT 2000 | Todd Murphy

Dave, you are right you would expect the soldermask to be higher than all SMT pads on the pcb if it is higher on the fine pitch components, but the other areas of the board do not concern me as much as the fine pitch areas. The pads on all the other

BGA short

Electronics Forum | Thu Dec 15 11:06:05 EST 2005 | Samir Nagaheenanajar

You might wanna try a small reduction in your stencil aperture. For example, for a 30-mil pad go 26-mil square aperture with 8 to 10-mil radius on your corners. Also, look at your designs. Is there enough resist between your pad and ball? Another

fine pitch printing

Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas

Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r


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