Electronics Forum | Fri Jun 04 09:20:55 EDT 1999 | HST-SE
Al, We make stencils, and I was personally involved at AMTX when the electroformed process was developed. Some of this will sound like an ad, but everyone has been volunteering vendors and so look at this as a suggestion. Electroforming is an addit
Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Thu Dec 08 14:26:58 EST 2005 | chunks
Start with your board first. Do you have resist/mask between the fine pitch? Is the finish HASL or a flat surface? If there is no mask/resist between the fine pitch leads you may want to reduce the apertures 5%. If the board is HASL, that means yo
Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon
| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Thu Jun 17 19:40:11 EDT 1999 | Scott Cook
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Thu Jun 17 19:40:27 EDT 1999 | Scott Cook
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Thu Jun 17 19:41:29 EDT 1999 | Scott Cook
| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton
| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w
