Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca
I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem
Electronics Forum | Sat May 27 09:45:52 EDT 2000 | Bob Willis
Many thanks for the name check from John Thorup PIHR can be done very simply and it can provide positive fillets on both sides of the board. I have just finished a line with SDSRS, Simultanouse Double Sided Reflow Soldering thats sodering both sides
Electronics Forum | Wed May 24 15:28:09 EDT 2000 | John Thorup
Hello Travis I'm going to have to disagree with your evaluation of intrusive reflow. It's not just for low end and,if done correctly, you will not have lots of half soldered leads and touch up will be minimal if at all. I'm sure that others will ag
Electronics Forum | Wed May 24 11:21:32 EDT 2000 | Travis Slaughter
Its my understanding that so long as the paste is not exposed to air it is not going to be active, someone else might be more sure about this than I am. Be ready for lots of half soldered leads using this process. Its quick and easy but will not b
Electronics Forum | Sat Dec 15 06:34:54 EST 2012 | sowmya
Normally paste manufacturer specifies stencil life of a paste is 10 hours. the question is, if i run a continuous manufacturing for 40 hours, we will be adding 250 g of paste for every two hours. The addition of 250 g will be mixed with the paste whi
Electronics Forum | Mon Dec 17 09:38:27 EST 2012 | cyber_wolf
Why scrap paste if there is no degradation of performance? Do your own study to determine this.
Electronics Forum | Mon Dec 17 08:34:58 EST 2012 | emeto
I would scrap it. As you said part of it is going to be old paste. All manufacturers don't recommend mixing old with new paste because you change the rheology of the paste.
