Electronics Forum | Tue Jul 21 21:09:49 EDT 1998 | Steve Gregory
>Have you looked into legal crap like >>proprietary aperture designs. I didn't know it >>but some of these pick and place vendors >>actually have patents on things like pad and >>aperture geometry. Personally, I think that's >>crazy and shouldn't b
Electronics Forum | Wed Jul 22 13:59:52 EDT 1998 | Justin Medernach
>Have you looked into legal crap like >>proprietary aperture designs. I didn't know it >>but some of these pick and place vendors >>actually have patents on things like pad and >>aperture geometry. Personally, I think that's >>crazy and shouldn't b
Electronics Forum | Sun Dec 08 23:40:19 EST 2002 | nonotalent
Hi all, We are currently having problems with > a laser-cut stencil that is electropolished and > nickel plated with 9-mil openings. The paste > does not release well from the apertures. We are > having to wipe after every print. The board is >
Electronics Forum | Wed Nov 09 04:16:14 EST 2016 | lachrymal
Hi MPMENG, Thanks for you reply. I must say I am printing onto wafers& I'm still somewhat new to the process but much of the theory is the same as for PCB. I trialled it in the mean time and I did find that printing into the long side of the pad wa
Electronics Forum | Fri May 29 05:43:05 EDT 2020 | ameenullakhan
Hi Team, what we have observed is that tension basically at the center of the stencil is less . And it directly depends on the number of aperture opening we have . More the opening less the tension. But there is no supporting document for the same
Electronics Forum | Tue Feb 25 18:36:03 EST 2020 | emeto
Flat surface is the number one choice for fresh part soldering. We did not discuss details about resistor size and location, but to keep them flat I will suggest no apertures on the stencil.
Electronics Forum | Thu Apr 12 01:23:04 EDT 2001 | Eric C
Check the pad size. I had this issue before due to the pad size too wide. R&D had change the size of the pad and is solve the issue. Before the pad size change, I had rebuild another stencil with the pad opening close to the component size. It won't
Electronics Forum | Thu Jun 28 08:24:34 EDT 2001 | Steve Vargas
Herb: Try oversizing your stencil fiducial openings to maybe twice the size of the board fiducial. When aligning manually, look for uniformity in the annular ring which appears around the fiducial. Hope this helps.....
Electronics Forum | Wed Jan 21 06:49:44 EST 2004 | mk
During a discussion about smt design one of our attendees said that he had been taught that stencil openings were typically designed .005 below the size of the copper smt pads. My experiance has been stencils are usually designed 1 to 1 with the copp
Electronics Forum | Thu Jan 02 22:09:15 EST 2020 | Zack
Hello, Can you give more detail on LGA parts in question? is 50 mm x 50 mm is overall size of the parts? What about pad pitch and how big is the pads individually? I assume that 50x50 mm is overall size. How about the stencil opening for the LGA pad
