Electronics Forum | Wed Jan 21 10:41:57 EST 2004 | davef
Depending on how you frame the question, either of you could be correct. Neither of you mentioned stencil thickness, which together with aperture opening [and stencil fabrication technology] define how well a paste will release. So, the key measure
Electronics Forum | Fri Jun 29 15:35:32 EDT 2012 | gnus
The stencil doesn't seem to match the pcb. On the pcb there seems to be pads that are wider than others whereas the openings in the stencil seems to be uniform. As Phil mentioned, make sure the gerbers match the stencil. As for no fiducials, that sho
Electronics Forum | Fri Sep 11 00:52:09 EDT 2020 | rsatmech
Thanks for your response. I am reducing the stencil opening and ensuring no solder paste deposited at the cornor of the pad. Not moving to homeplate design considering the component size. Will share the exact design.
Electronics Forum | Thu Aug 27 15:50:47 EDT 1998 | MMurphy
| General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of the pa
Electronics Forum | Thu Aug 27 16:07:10 EDT 1998 | MMurphy
| | | General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of t
Electronics Forum | Thu Aug 27 14:13:36 EDT 1998 | Dave F
| General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of the pa
Electronics Forum | Tue Jan 30 15:30:17 EST 2001 | dason_c
Please check what is the actual pitch size. I found some of the designer use 15.7 mil pitch and no accumulate ie 15.7, 15.7 and 15.8...... Also, I recommended the pad width should be 10 - 11 mil for 0.4mm pitch. You can open the 10 - 10.5 mil aper
Electronics Forum | Thu Aug 27 13:46:42 EDT 1998 | Rob Williams
General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of the pad
Electronics Forum | Wed Apr 27 07:16:40 EDT 2005 | jdumont
Thanks a lot guys. The part dims are in mm by the way. So last night i was looking at the .pcb file and saw that the pad size and stencil are both .013" while the ball on the BGA is .018" (sorry for switching from metric). Is this ok or can i have en
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
