Electronics Forum: stencil tension analysis (Page 12 of 24)

Programming Software

Electronics Forum | Sat Jun 08 04:48:39 EDT 2013 | jlawson

Also Valor MSS Process Preparation from mentor is a option Has the most complete solution on market, covers what CircuitCam does but can offer more options as you need, auto-generation of SMT parts for programming machines, DFT Probing, Stencil Optim

Alpha tetra bond stencils vs Vigon SC200

Electronics Forum | Fri Apr 10 12:23:27 EDT 2015 | utosun

The recommended wash concentration for stencil cleaning with VIGON SC200 is 25% and this should be confirmed using the ZESTRON BA-20 bath analysis kit. Additional cleaning recommendations are: Wash temperature should be approximately 25 degrees C. /

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 13:48:03 EDT 2023 | spoiltforchoice

Well gasketing yes, have you dine enough analysis to blame aperture design- Maybe not? Maybe whip out the gerber files for this PCB&stencil and compare the details with one you feel works well. Is there something different about their layout rules o

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

Solder on gold finger

Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007

We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f

Stencil aperture positional accuracy

Electronics Forum | Thu Jun 14 21:48:41 EDT 2012 | kmots15

We work with a lot of larger boards over 24", haven't run into this issue yet. I agree with scott could be your board supplier if they are lower quality, from something as simple as unit conversions in CAD to dealing with different temperatures. A

Self Tensioning Frames

Electronics Forum | Tue Jan 28 11:02:36 EST 2020 | dontfeedphils

Eh, the stencils have numbers on the labels from the manufacturers and I have yet to put numbered "tick" marks on each shelf, so locating the stencils in this sort of storage solution won't be a problem. I'm surprised you had so many issues with the

Re: STENCIL CLEANING WITH SOLVENTS

Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber

According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c

Voids in solder fillet

Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire

Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon

| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is


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