Electronics Forum | Fri Nov 23 14:47:35 EST 2001 | kgroen
Some comments on the previous post: Be careful when looking at the proportion of SMT defects that are solder defects - you may very well find that only a small few of them originate at the screen printing step. As for specification limits for pas
Electronics Forum | Wed Jan 30 12:53:58 EST 2008 | tonyamenson
In approximately one month I am installing 2D at our DEK print station. We are going with the basic (cheap) software options and 2D camera. After it is up and running we will determine if it is indeed useful. At that point we will decide on the adva
Electronics Forum | Fri Apr 17 21:34:02 EDT 1998 | D.Lange
| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu
Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice
Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl
Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Fri Apr 23 04:02:22 EDT 1999 | Scott Davies
I need to know if there are any special component pad designs that need to be considered when evaluating paste-in-hole? We have a few through hole connectors that are good candidates to place pre reflow. Does anyone have sugguestions. Thanks Chri
Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
Electronics Forum | Tue Mar 04 07:23:15 EST 2003 | msivigny
Hello ricardof, To implement Cpk studies on SMT production equipment, you will require highly accurate glass plates, glass component slugs, accurately manufactured stencils and a measurement system to perform X, Y and Theta positional deviations from
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