Electronics Forum | Tue Mar 04 07:23:15 EST 2003 | msivigny
Hello ricardof, To implement Cpk studies on SMT production equipment, you will require highly accurate glass plates, glass component slugs, accurately manufactured stencils and a measurement system to perform X, Y and Theta positional deviations from
Electronics Forum | Mon Jul 21 08:34:44 EDT 2003 | Don Bell
Blow holes/ pin holes in solder joints are the result of multiple root causes. Suggested analysis might look like this; 1) What method of solder preservation is used on the bare board. (hasl,enig, osp, etc.) HASL can leave unwanted flux residues,
Electronics Forum | Mon Jan 09 23:24:47 EST 2017 | saju86ece
Hi, We are doing pin in paste reflow process in one our product ( but paste printed on bottom side of the board and top side will be assembled through hole component)in which faced cold solder issue in THT capacitor location after reflow. The solder
Electronics Forum | Fri Aug 04 13:47:20 EDT 2006 | pemea1
apples to apples. 20 boards 80 parts top and 10 parts bottom. these boards are done on a semi regular basis (you know the boards are coming to you from an OEM at least three times a month, just no exact schedule). All that is required is pasting..mo
Electronics Forum | Tue Jun 18 07:14:49 EDT 2013 | jlawson
Yes Aegis and Valor are good choices in terms of NPI, SMT programming , which one you choose will depend on other factors, Valor offers I feel a more rounded product, ie under one platform. Both offer CAD-BOM to SMT and Documentation, but Valor offer
Electronics Forum | Thu Dec 08 20:04:01 EST 2022 | madmungrel
Hi there Siemens Valor Proceed Preparation is a alternative that I would say ticks your boxes as is more focused on PCBA NPI process , from Cad-Cam Data clean up SMT programming, Stencil Design, Assembly Panel Design, Test Engineering, DFA analysis
Electronics Forum | Sun May 19 16:54:48 EDT 2024 | wijim
FAB 3000 - This software offers a comprehensive suite of tools for Gerber editing, panelization, and DFM verification. It's designed to be user-friendly and includes features for SMT stencil pad creation, advanced DRC/DFM checks, and more. Cadence Al
Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn
It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Tue Jul 13 13:51:51 EDT 1999 | Earl Moon
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
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