Electronics Forum | Thu Jan 07 16:40:26 EST 1999 | MMurphy
| | What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | | | Ken Mok, based in Shenzhen, China. | | | | | |
Electronics Forum | Sat Jan 09 16:01:18 EST 1999 | Jason Hall
| What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | Ken Mok, based in Shenzhen, China. | | Ken, I have neve
Electronics Forum | Tue Apr 27 13:41:16 EDT 1999 | Scott McKee
| i am trying to design a stencil fixture for manual printing. has anyone done this before or has an idea? thanks | There are sooo many variables; product size, 1 vs. 2 sided boards, support, component size, pitch, stencil alignment, PCB thickness,
Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton
We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac
Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
Electronics Forum | Wed May 22 12:39:00 EDT 2002 | pwrgroup
and the two ratio is changed if you use different thickness sheet or step-down or step-up.I think real time calculator of the two ratio is very important for tranfer efficience.
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Wed May 22 12:39:06 EDT 2002 | pwrgroup
Hmmm... Why would you want to to this? I > understand your concern, but why not let your > stencil house manipulate your Gerber and send you > a copy of it before they cut a stencil? Saves > you time and money. Sit down with your stencil > m
Electronics Forum | Wed Feb 22 10:00:58 EST 2006 | dougs
We've just set up a couple of products with 0.5mm pitch uBGA devices on them, i went for 5thou thick, laser cut nickel (to aid paste release) square pads same size as the diameter of the uBGA pads. Or you could go to a 4 thou nickel stencil, better
