Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton
We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac
Electronics Forum | Thu Jun 03 10:00:40 EDT 1999 | Earl Moon
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al | We use electroformed when xtra or very fine pitch devices are involved. Very expensive propos
Electronics Forum | Sat Apr 10 10:01:43 EDT 1999 | Jeff Price
| | I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling | | | | thank you | | | -I have had wonderful results with
Electronics Forum | Thu Oct 21 14:02:32 EDT 1999 | Ron Costa
We are a contract manufacturer currently building a job with IBM CBGA-255 devices and 20mil QFP's that are close to each other. We use a 6 mil laser cut and electro polished stencil with one to one apertures on the BGA's. The customer is experiencing
Electronics Forum | Mon Oct 14 03:14:08 EDT 2002 | msimkin
Hi, Has anyone had expereince in the design or use of mini rework srtencils for uBGA applications? What was the deisgn guide lines used. I am looking to rework 0.7 & 0.65 mm uBGA parts with standard hot air, without split prism placement guides. It i
Electronics Forum | Mon Oct 25 15:23:26 EDT 1999 | Dave F
Ron: You're really talking about a step-up stencil in the area of the BGA. I don't think your problem is a lack of solder, but who know? I think you should do some sections on returned boards from your customer to help determine the source of the
Electronics Forum | Mon Oct 14 09:31:46 EDT 2002 | russ
First off, are you planning on placing these parts with your placement machine since you mentioned that you do not have an alignment system for rework? I would be leery of handplacing a BGA into paste by steady hand and craned neck alignment. Seco
Electronics Forum | Mon Oct 14 17:28:08 EDT 2002 | msimkin
Russ, Thanks for the feedback. Yeh, we are placing them in production using a full ball detect Yamaha placement machine, 5 thou square stencil. etc.etc. The only reason I raised this concern was from a rework point of veiw (actually, the board desi
Electronics Forum | Fri Oct 22 06:19:42 EDT 1999 | TNT
Ron, if I am reading this correctly the 20mil parts are not having problems on a 6mil stencil. If you increase the entire thickness of the stencil to 8mils, there should not be any issues with the 20mil components. The supports you are using could p
Electronics Forum | Mon Oct 14 17:59:45 EDT 2002 | russ
When I used the micro-stencils, We purchased the holder from the stencil manufacturer. As far as design we used 5mil stencils for uBGAs,6-7 mil for larger 63/37 balls, and 8 mil for CBGAs. Aperture openings used were slightly smaller than what we wo
winsouce.jpg)
