Electronics Forum: stencils bga (Page 8 of 63)

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 05:43:15 EDT 2018 | cmchoue

Thank you Mr.Spoiltforchoice, My question is not clear , let me show you a photo Did you have any suggestion? Thanks James

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o

Hi Jandon, Thanks, I will try it on my DOE.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97

Use a type 5 solder for maximum paste release.

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Mon Mar 23 16:38:09 EDT 2020 | emeto

Steve, On 16mil pitch I would try 12mil diameter on 5mil stencil, unless the BGA ball size is something unexpectedly huge.

Solder Paste Dispensing for BGA repair

Electronics Forum | Tue Nov 16 09:37:53 EST 1999 | Ted C

Is anyone out there using automatic despensing equipment rather than stencils for depositing paste on BGA patterns prior to placement/repair. What is minimum dot size that can be reliably applied. Pro's/con's?

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 11:24:56 EDT 2018 | davef

pdf "BGA Stencil design guideline for avoid bridge" As you would expect, Google found 40,000+ results in less than a second One of my favorites was Power Point Presentation by Greg Smith [gsmithATfctassembly.com] at FCT Assembly: "Improve SMT Assem

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH

Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems

BGA Aperture

Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev

Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo

Re: BGA Shorting problem

Electronics Forum | Tue Sep 01 22:41:13 EDT 1998 | Kelly

| Hi Kelly, | A couple of questions first. what type of BGA are these components? CBGA, PBGA, TBGA, etc. What is your aperture diameter on your stencil and what stencil thickness are you using? I think I can be of more help once I know the answer

Kapton Stencils for Prototyping

Electronics Forum | Fri Mar 07 15:57:32 EST 2014 | jdengler

We have used the Stencilquik™ BGA Stencils from the same supplier to attach some LGA's for a prototype run. We were able to get a few different thicknesses to see which worked best. They worked very well for that limited application. We did not tr


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