Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
Electronics Forum | Mon Oct 07 23:04:05 EDT 2019 | SMTA-David
Hi, I have a semi-Auto paste stencil machine and use laser cut stainless stencil with T4 paste. When I start pasting boards the paste covers the pads and is well defined. Throughout the job we have been having some issues with feeder on pick and pl
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan
Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Jun 25 12:07:00 EDT 1999 | John Thorup
| | hello, | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | thanks for the input | | | | wayne | | | | | | | We have tried this mainly on thru hole connect
Electronics Forum | Thu Dec 17 15:53:32 EST 2020 | dwl
for option 3, if you place the connectors on the first pass then flip the board, won't the protruding leads interfere with second pass stencil printing? My vote would be to overprint onto the solder mask. you can print pretty far and still have it w
Electronics Forum | Sat Oct 12 05:40:05 EDT 2002 | Kenture
Hello All, I am having issued with insufficient solder due to via in pad. It is a 10 mils via and PCB is 70 mil thick. Six mils stencils was used since there are some 20 mils (No clean process). Any recommendation? Thank you.
