Electronics Forum | Wed May 22 12:39:00 EDT 2002 | pwrgroup
and the two ratio is changed if you use different thickness sheet or step-down or step-up.I think real time calculator of the two ratio is very important for tranfer efficience.
Electronics Forum | Sun Nov 24 05:40:45 EST 2002 | albertoh
Hello!! I have a question about what kind of squeegee blades i need (this is not about lenght) for any step-down stencil in order to get better results in my process. Thanks in advance.
Electronics Forum | Mon Jan 12 20:43:39 EST 2004 | Al
who has the step by step how to reball a Ceramic BGA this is a CBGA 50 mil pitch 29 by 29 mm size
Electronics Forum | Tue Mar 09 13:14:28 EST 2004 | rob_thomas
hi, send me the data for the bds.(gerber,DXF) and I'll give you some step by step info on how to profile this bd w 3 TC and the oven software. R
Electronics Forum | Fri Sep 17 03:25:45 EDT 2004 | soease
Hi all, does anyone of you use step stencils for paste application? Did anyone experienced troubles with those kind of stencils? thanks for answer sly
Electronics Forum | Fri Sep 17 09:31:17 EDT 2004 | russ
Step stencils are used but only when necessary. One reason to use one would be a PCB with 12 mil pitch and very large coils or something of that nature. The 12 mil pitch part would require a 4 mil thick stencil to ensure release while it would caus
Electronics Forum | Fri Sep 17 09:44:26 EDT 2004 | davef
We agree with Russ. * Haven't used them in 10+ years. * Size of keepout for the stepped apertures needs to be large. * Manipulating aperure size to manage paste volume for specific components is not difficult.
Electronics Forum | Wed May 18 09:39:28 EDT 2005 | Zsolt
davef is right, what we have done is that for every step in the flowchart we made a separate FMEA. Not only machine and process steps but also warehouse and product handling, identification, etc.
Electronics Forum | Thu Dec 08 10:50:48 EST 2005 | Gary
Go to http://www.minimicrostencil.com and look up the rb-2000. There is a step by step discription of how to do it and as mentioned before you will need a thicker stencil for your application. there will me a list of stencil types at the web site t
Electronics Forum | Thu Feb 23 23:24:14 EST 2006 | KEN
Depends what is adjacent to the step. 1206 chips could reside closer than say a 16 mil fine pitch. Larger apertures are more forgiving to height variations than small apertures.
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