Electronics Forum | Tue Apr 09 15:24:29 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Fri Jan 31 09:38:58 EST 2014 | pavel_murtishev
Hello, I am trying to estimate hole filling after PiH process using phoenix x|aminer X-Ray Machine. The question is how to select correct inspection voltage? Inspecting at 60kV 40uA all PiH holes appear to be completely black, that means completely
Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG
Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more
Electronics Forum | Mon Mar 11 04:57:31 EDT 2013 | bobpan
You really should edit your programs in central controller where it is much easier to follow the commands shown and to follow the extent data to see whats attached to each part/pickup. The hht can quickly cause issues when the wrong button is presse
Electronics Forum | Sat May 14 17:25:20 EDT 2005 | fastek
"What can be done to create economical advantages over here is review the product flow and eliminate process steps with current existing technology. Process steps that can safely be eliminated are cleaning, visual inspection, post wave assembly etc.
Electronics Forum | Tue Jun 16 15:10:27 EDT 1998 | Bob Willis
Simple x-ray inspection works well have a word with those nice people at Nicolet or Glenbrook. One of them was featured on my x-ray training video for BGA. A procedure for inspection criteria is on my web site if it is of use. | | How do I mechanical
Electronics Forum | Mon Jun 08 14:52:46 EDT 1998 | Mike
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Mon Jun 08 16:20:43 EDT 1998 | Earl Moon
| | How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can
Electronics Forum | Mon Nov 02 23:01:59 EST 2015 | dan59314
RvConverter AOI/AVI CDR tools free download Users Manual: http://www.rasvector.url.tw/RvConverter/RvConverter使用手冊.pdf Easy to use : Generate AOI data in just 2~3 steps. 1. Load File. 2. define Output Region/Resolution(Optional)
Electronics Forum | Mon Jun 08 10:45:25 EDT 1998 | Henry Hickey
How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pres
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