Electronics Forum: strained wires (Page 1 of 1)

Etch strain gauge in copper layer to measure deformations during press process [How to?]

Electronics Forum | Sat May 17 10:38:49 EDT 2014 | sarason

I hate to say this but in all probability this wont work. I have built real strain gages and they depend on the change(Co-effiecent) of resistence with strain(or Stretch). since you are connecting you elements up with copper wire it will frm part of

Etch strain gauge in copper layer to measure deformations during press process [How to?]

Electronics Forum | Fri May 16 05:17:13 EDT 2014 | julianf

Interesting. How did you connect the gauges in the press? Our press only has connections for thermocouples. But in essence, it's only a wire and an electical output. If you placed these prefabricated gauges on top and on the bottom surface, weren't

Temperature Profiling

Electronics Forum | Thu Dec 10 19:15:07 EST 2009 | swag

We like to keep one fully populated SMT golden per product (high volume) with t-couples soldered to it. We have best results using high temp. solder to attach t-couples (most permanent). 1) Remove all production solder from the part you are wanting

Thermocouple attachment on fine pitch component.

Electronics Forum | Wed Apr 11 17:03:28 EDT 2001 | mparker

I've used Super Glue, with Kapton tape. The glue leaves a small residue and the tape acts as a strain relief. If you can sacrifice the board, drill a small hole through the board, push the exposed ends of the thermocouple up from the back side, lay

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell

| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

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