Electronics Forum: structural (Page 13 of 30)

FUJI CP743 anyone???

Electronics Forum | Fri Apr 27 13:57:19 EDT 2001 | CAL

I agree "can't put teens with learner permits on NASCAR raceways and expect them to succeed" I am confused though....Once the program is sent to the machine the line computer is there just for line monitoring (Errors and alarms). The machine runs wi

Re: Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc

I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to

Agilent 5DX

Electronics Forum | Tue Jul 31 20:55:36 EDT 2001 | davef

Just so that you know, the 5DX does laminography. Like the word lamination, laminography takes a series of short focal length xrays, each a little deeper than the previous. Microlaminography allows layer by layer information to be measured in 'slic

More info

Electronics Forum | Fri Dec 10 10:49:24 EST 1999 | Mike F

Some of our boards have over 700 LED's, so looking for the long leads is the most accurate way to check polarity. Also, not all LED's have a flat side and tinted domes can make it difficult to see the internal structure. Auto insertion didn't work, f

Re: SMT Zero-defect Soldering

Electronics Forum | Thu Dec 02 11:28:03 EST 1999 | Mark D. Milward

Dave F. Thanks for the info. I've spoken with Ralph and Les Hymes in the past and have taken Manko seminars before. I read something not long ago that Dr. Juran had written on the subject of Zero-defect soldering programs and was hoping for response

Performance estimation of SMT-assembly-Systems

Electronics Forum | Tue Aug 31 10:52:19 EDT 1999 | Andreas Foehrenbach

I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under differ

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

New technology introduction process

Electronics Forum | Mon Jun 07 15:05:07 EDT 1999 | Mike Zurn

We are in the process of refining our process to introduce new and advanced technologies into our company and I was wondering what type of system your companies use. A few questions that you may consider include: 1. Do you have a separate group res

Re: "Superboy" needs HELP

Electronics Forum | Fri Jun 26 09:01:25 EDT 1998 | Justin Medernach

| | Hi all, | | I've received an interesting opportunity. I'm in the contract mfg. game at the prototype level. I have a chance to build a Flip Chip test vehicle. I know little about the process but am very familiar with the packaging / process te

The glue with the holes...

Electronics Forum | Tue Oct 16 18:42:32 EDT 2001 | mparker

I go with DaveF's advice. You are probably curing the glue too fast. Another phenomenon that I have experienced was during glue cure and solder paste reflow simultaeously. A good reason to run a glue cure profile seperately from solder paste reflow


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