Electronics Forum: structural (Page 2 of 30)

SMT Shields technology

Electronics Forum | Tue Aug 24 08:42:44 EDT 1999 | Chaim Krief

I am looking for information about SMT shields thcnology. Thats include Diecasting, Laser Cutting, Photo- Etching, Mechanical Enclosures & Stamping. Shilds types : Mechanical Structure,Pick up options,plating etc.

Component Identification

Electronics Forum | Thu Apr 22 02:25:29 EDT 1999 | Ron Lahat

I'm looking for a book that contains all electronic component manufacturers Logo's and their P/N structure This book is needed by our QA/QC personal

Books on TPM

Electronics Forum | Sat Dec 06 07:37:46 EST 1997 | Raymond

Are there any good books on TPM (Total Preventive Maintenance) ? I am trying to set up a good maintenance structure/system in my company to maintain the SMT equipment. Any suggestions will be appreciated. Thanks.

ALIVH pcb

Electronics Forum | Tue Apr 09 18:29:34 EDT 2002 | davef

Any-Layer Interstitial Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve high-den

silver pads, reflow charateristics??

Electronics Forum | Wed Jan 15 19:27:43 EST 2003 | praveen

Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.

silver pads, reflow charateristics??

Electronics Forum | Wed Jan 15 19:27:44 EST 2003 | praveen

Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.

Cp vs Cpk

Electronics Forum | Tue Jul 08 18:37:54 EDT 2003 | MA/NY DDave

Hi AlC, Q: Who calculates Cp, Cpk. It depends on the company, it's size and structure. Some expect the SMT / Process Engineer to do this work and others have all kinds of other groups involved. YiEngr, MA/NY DDave

Pb free BGA and Sn Pb solder paste

Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken

...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.

Recommendations? Fuji CP7 or Univ HSP4797?

Electronics Forum | Wed Jun 23 00:47:54 EDT 2004 | Justanobody

Really? Unhappy with the support structure within Fuji. Is that why Jabil Brazil and Guad. are buying a boat load of Fuji's latest machine. Plus, the CP7 isn't sold any more. Get up to date, its a CP8.

Plating thickness

Electronics Forum | Fri Sep 17 13:51:43 EDT 2004 | huib

We know from experiments that the structure of Sn can be manipulatedby means revese pulse-plating. This means alayer with less pits and thus a lower mminimum thickness is needed. www.ppcs.nu


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