Electronics Forum: structural (Page 4 of 30)

Cracked MLCC's

Electronics Forum | Mon Aug 19 09:42:41 EDT 2019 | edhare

Dave, Perhaps, but my interpretation of that photo is that it simply shows a knit line fracture that propagated out to the surface. The fact that it shows on the termination is not surprising since the termination wraps around the internal plate st

Fuji AVL import

Electronics Forum | Fri May 17 12:09:09 EDT 2024 | ahaspherus

Hi there! Fuji job builder has import field in AVL editor, but I can't find what type/structure of data can be imported. Thanks.

Fuji AVL import

Electronics Forum | Tue May 21 09:41:24 EDT 2024 | ahaspherus

Thanks a lot! I've already got this file. I'm asking about inner structure of txt file that can be imported within AVL editor.(File - Import)

Loctite Adhesive Viscosity

Electronics Forum | Tue May 15 14:23:20 EDT 2001 | medernach

Again, I'm not familiar with your material but SMT Adhesives as a collective group are typically hydroscopic. An increase in humidity in your facility will lower the viscosity of certain materials. I don't want to say who's material I've had bad ex

Re: Reflow cooling rates

Electronics Forum | Mon May 10 13:55:22 EDT 1999 | Deon Nungaray

| Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | I do not think there is a "typical" post reflow cooling rate out ther

Reflow profile negative temp ramp rates

Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw

Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an

Placement machine comparison

Electronics Forum | Mon Jun 17 09:41:41 EDT 2002 | caldon

I always look into the Support Structure (Service, Applications, Training, Project/product management) of the organization. With that said I have to give Assembleon the edge. I also like the relationship between Cookson and Assembleon. Cookson Perfor

DEK ELA?

Electronics Forum | Mon Aug 12 13:11:47 EDT 2002 | pjc

I am not a DEK user but have some knowledge of the ELA to share. The ELA has some structural differences with the Horizon and Infinity models. It is DEK's low-end automatic printer (a cost-reduced version of the Horizon model)and is manufactured in C

No Lead BGA Hot Gas Rework

Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken

I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col

market statistics on SMT Assembly ?

Electronics Forum | Fri Dec 08 12:38:51 EST 2000 | Andreas Foehrenbach

Hy all, i'm in need for some data about the electronics market: - general Industry Data of SMT and SMT Assembly - SMT-worlwide Production / Turnover - ratio of THT / SMT - Structure of productions cost (Parts, PCB-Assembly, Final Assembly, Investmen


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