Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko
Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath
Electronics Forum | Wed May 31 05:32:14 EDT 2000 | F.Frimpong
Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) conta
Electronics Forum | Fri May 03 00:36:36 EDT 2002 | caldon
Not many tech stocks not plunging. Pete is correct.......You application should determine the machine not the machine determine the application. That is why there are machines from $15K(US) to +$400K. Mechanical, Laser, vision.......servo, linear...
Electronics Forum | Mon Dec 18 22:28:03 EST 2000 | Charles Harper
I believe this is the case for the new,high performance LCPs(liquid crystal polymers),which are unique in their stiff,relatively thermally immobile structures.For other materials with higher Tg values than FR4,the basic relationship holds,but expansi
Electronics Forum | Tue Jun 19 18:15:22 EDT 2001 | davef
What do you mean when you say "structure"? Taking a different tact to get at an answer to the original question, if applications such as general, BGA attach, and die attach inspection require a resolution of 10 units. What would you suggest are the
Electronics Forum | Fri Dec 03 18:23:26 EST 1999 | Dave F
Mark: I'd say Woodgate has as structured zero defects soldering program as anyone. That's great that someone is funding your start-up. I'd suggest that you get (or find someone who is technically competent and) comportable with selling. My2� Dav
Electronics Forum | Fri Feb 13 03:26:07 EST 1998 | Brian S. Bentzen
Hi , The 4th stage in reflow soldering, the cool-down, I find is often over looked. A rapid cooling rate should give finer lead and tin structure with more bindings and thereby result in stronger solder joints. Can anybody give me some information
Electronics Forum | Fri Nov 09 20:15:26 EST 2001 | caldon
I concur with Dave.....I have done this often with little fall out. After rework reflow we would x-ray just to ensure an acceptable joint structure. Just for curiosity sakes....are you removing a defective BGA and replacing with a good one? Site pre
Electronics Forum | Sun May 12 23:40:03 EDT 2002 | caldon
Both are good machines. I think the variable here is : 1)The topaz has been around longer and more time to be refined. 2) Support structure- I give the nod to Assembleon for this one. They have a stronger Apps and FS devision. Are these the only two
Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon
Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta
