Electronics Forum | Wed Apr 22 20:55:04 EDT 2020 | SMTA-Samy
The ideal cooling zone curve should be a mirror image of the reflow zone curve. The more closely this curve mimics the reverse of the reflow curve, the tighter the grain structure of the solder joint will be upon reaching its solid state, yielding a
Electronics Forum | Wed Aug 07 15:58:17 EDT 2024 | SMTA-64386252
Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides. A cross section in a non-touched up sample could be performed to validate the solder
Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp
CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly
Electronics Forum | Wed Oct 03 23:42:32 EDT 2018 | gaintstar
SMT Reflow Oven Factory http://www.flason-smt.com/product/SMT-Reflow-Oven-Factory.html Introduction of SMT Reflow Oven Factory: 1. Windows XP platform, user friendly interface and easily swap between bilingual of English & Chinese. 2. Digital contr
Electronics Forum | Tue Feb 19 10:09:48 EST 2002 | caldon
I always look at the support structure. This is where I feel the real Dollars and cents come into play. Sure you can calculate the derated value over months or years. But If your machine is in a "machine down" situation the derated value does not cha
Electronics Forum | Wed Jan 23 23:45:35 EST 2019 | kiransahu
Piezoelectric type (office/industrial) In this method, a piezoelectric (piezo) element, whose volume is deformed when voltage is applied, is used to discharge ink particles. This element is attached to the component that is filled with ink. Then, th
Electronics Forum | Mon Nov 13 04:57:27 EST 2000 | Wolfgang Busko
Hi Richard, I assume that you deal with a component that has 20mil pitch. In this case depending on your pad design you get from 8 to 10mil spacing for your apertures. With a slight reduction of the aperture (10 to 15% for avoiding shorts)and a 6mil
Electronics Forum | Thu Aug 24 17:08:58 EDT 2000 | Dr. Ning-Cheng Lee
Depending on the stress condition experienced by the solder joints. For joints under a greater stress, the time to reach equilibrium can be shorter. Of course, the change is also more significant in phase structure. For low stress conditions, it may
Electronics Forum | Fri Nov 12 10:36:33 EST 1999 | Dave F
Wolfgang: Sure, stacking chip components is common practice in prototyping, as you say, but it's not good practice for production work. Documentation: * ANSI-IPC-275 does not allow stacking * MIL-STD-2000A does not allow stacking * J-STD-001B is u
Electronics Forum | Fri Oct 09 17:18:22 EDT 1998 | David Spilker
| I am looking for data on share of SMT components in the total components market. I would like to quote in a study on how many boards are manufactured completely in SMT and how many are in mixed technologies. I would like to show the developpement o
