Electronics Forum | Mon Jun 29 13:44:45 EDT 1998 | Russ Miculich
The mini-BGA was to be smaller than the standard BGA and larger than the micro-BGA. The last I heard there will be no mini BGA but companies such as Tessera, AMKOR-ANAM, etc. will go directly to supply 0.020" center to center pitch micro-BGA's. You
Electronics Forum | Wed Dec 10 13:56:26 EST 1997 | Scott R. Cook
| Are there any good books on TPM (Total Preventive Maintenance) ? | I am trying to set up a good maintenance structure/system in my | company to maintain the SMT equipment. Any suggestions will be | appreciated. | Thanks. Try to locate: Introductio
Electronics Forum | Mon Apr 22 13:05:52 EDT 2002 | davef
Try: Somar Corporation, 11-2, Ginza 4-chome, Chuo-ku Tokyo 104-8109, JAPAN http://www.horiba.co.jp/ +81 3 35422151 +81 3 35422056 Not to imply there is anything wrong with Somar's material [having never used the material], just looking at an alterna
Electronics Forum | Fri Jan 24 11:05:38 EST 2003 | johnw
I fyour just using Sn/Pb in your paste even using nitrogen will lave you with slightly grainy joints. The silver from your PCB will disolve into the Sn/Pb at 'uncontrolled' rate what I mean is depending on the temperature and time above liquidous the
Electronics Forum | Mon Feb 24 15:14:21 EST 2003 | blnorman
Having worked with adhesives for years, the first thing to look at if there is a failure of this type is surface contamination. The subject has been discussed here also. A structural adhesive will increase in strength with a "hotter" cure. We also
Electronics Forum | Tue Jul 22 09:05:14 EDT 2003 | davef
Any-Layer Interstitial [Inner] Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve
Electronics Forum | Tue Jun 15 17:00:27 EDT 2004 | Rob
I'll jump on this bandwagon too... A crude method was buying a bread rack and widening it to the width of a fixed stencil. Since we get our foils from A-Laser, we get these card board squares. I would tape three of these pieces together to make a som
Electronics Forum | Wed Aug 04 15:27:03 EDT 2004 | Rush Fan
I might suggest that you check with your solder paste manufacturer to see what is recommended for time over reflow. Typically, I think most are between 60 and 90 seconds over 183. Also, consider the rate of cooling. The faster you cool the solder, th
Electronics Forum | Wed Sep 08 11:03:02 EDT 2004 | dj_jago
Peter, The Siemens placement equipment has a simple coding structure: HS50 - 50,000 CPH S20 - 20,000 CPH S23 - 23,000 CPH S27 - 27,000 CPH Well... you get the idea. I have no idea about the speed of the 'F' machines. We get around 70-80% of this
Electronics Forum | Thu Oct 14 06:27:45 EDT 2004 | davef
a disturbed solder joint. * Extended/slow cool down ramps can result in surface texture => grainy solder joint. Second, the "BGA scaling" could be a reflection of: * Too little heat (incomplete solidification) OR * Too much heat (excess grain growt
.png)
