Electronics Forum: structural (Page 10 of 30)

Mixed BGA's on one board

Electronics Forum | Thu Mar 09 16:29:35 EST 2006 | russ

Will the Pb part handle 240C? That is the first question that you need to answer. If it will then yes I would run the pbfree paste and profile. I assume that all other components are pbfree. If not, the same questions will need be asked as for th

Tin Whisker Formation?

Electronics Forum | Fri May 26 14:15:16 EDT 2006 | patrickbruneel

Its it possible to post a picture from right after reflow? To see what we start with and compare the difference after 5 years. The grainy structure is not as much a concern as the growth-like appearance on the boundary of the solder. What paste al

Wave soldering problem - strange colour of the solder

Electronics Forum | Fri Jan 19 10:43:28 EST 2007 | jimmyjames

You guys are all joking right?! There aren't any contaminates in your solder, the different colors on the surface are completely normal and even expected. The top layer of solder oxidizes and the structure of the surface resembles crystals, refract

JUKI file

Electronics Forum | Thu Jul 24 17:02:18 EDT 2008 | jlawson

OK , the H6H file is a binary structured file and can be read if you write a program in VB etc to extract the info you need, would take some time to sort out where to get what in the file, juki would no help you here.... Assuming you need placement

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 16:03:43 EDT 2008 | vladig

Well, typical content of Pb in Sn/Pb polating is a few percent (just to mitigate Sn whiskers growth). Therefore, the lead finished with SAC305 won't be much different from those finished with Sn/Pb. You can make one or two cross-sections for sanity c

Setting up Water Wash Plant

Electronics Forum | Sun Dec 07 03:39:05 EST 2008 | yngwie

Hi, I am setting up a Water Wash process. Can the Experts our there help me to understand the whole structure of the complete DI Plant setup to the Washer and back to the water waste treatment i.e. what filtering system needed in between, carbon/mix

Epoxy for holding large inductors

Electronics Forum | Wed Jan 14 17:07:46 EST 2009 | davef

In BIG-boy, high vibration applications to secure large components, we've used 3M #2214 structural adhesive [One part, 250*F (121*C) curing 100% solids, paste consistency epoxy adhesives designed for bonding metals and many high temperature plastics

Circuit cam?

Electronics Forum | Thu Dec 24 09:30:56 EST 2009 | fishingfool

Looking for an answer about file structure on CC. It has been 10 years since I have done anything with CC so bear with me. After you have created a job file that has all the components on it and the polarity parts have a pin 1 indicator, I need to

Implementing AOI

Electronics Forum | Mon Mar 08 16:23:05 EST 2010 | mikesewell

I'd think about database structure and programming aspects as well. I'm cleaning up an implementation where the parts were taught as they appeared to the AOI programmer irrespective of the Pick & Place data/libraries. Lots of rotation fixes, parts

Blow hole on pad after reflow oven

Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi

Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint


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